Hi-Lo Systems established first testing center in 2005 to extend our expertise into the field of IC testing services to satisfy the high demands coming from IT and the hand-held device market.
With powerful support from the Hi-Lo engineering team and over 200 sets of automated programming systems installed, Hi-Lo programming centers are able to offer comprehensive and competitive solutions for device programming, ink/laser marking, taping & reeling, 3D optical lead inspection, baking and dry packing, etc., including special requests of customized device programming and packing.